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IEEE 1101.2 PDF

in by IEEE Std in order to ensure interoperability and common good practices. Thanks to this standard, conduction cooled boards and chassis. Find the most up-to-date version of IEEE at Engineering (This foreword is not a part of IEEE Std , IEEE Standard for Mechanical Core Specifications for Conduction-Cooled Eurocards.) This document.

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In the conduction-cooled configuration, the component heat is removed by conduction to the chassis cold wall. Test yourself or your business online. However, in the event that the circuit card module is to be used in commercial non-military applications and convection cooled, then the wedgelock 3 would not be present.

The accompanying figures, in which like reference numerals refer to identical or functionally-similar elements throughout the separate views and which are incorporated in and form part of the specification, further illustrate the present invention and, together with the detailed description of the invention, serve to explain the principles of the present invention.

The reduction of thermal resistances and temperature rises is reflected in a reduced running temperature for component 6. High-performance synchronous bit bus: An adapter for commercial off-the-shelf COTS circuit card modules resulting in increased cooling efficiency.

Several patents, including U.

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Conduction cooled CompactPCI boards ready for insertion | GE Automation

DE DET2 en Although the wedgelock 3 would most likely be used in practice, a larger wedgelock can also be used in this alternate embodiment. Terms and Conditions Terms of subscription Online watch.

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Commercially-available, off-the-shelf components that are included in circuit card modules are often unreliable when exposed to the high temperatures present in, for example, the military environment. Fite Date of publication: The adapter frame of the present invention comprises an extended width wedgelock 13an extended width shim 15and an extension 16 to the existing frame 1 so that the circuit card module contacts the cold wall of the conduction-cooled chassis 2.

These items are replaced with the adapter of the present invention to increase the surface area contract between the cold wall of the chassis and the strip in contact with card 7 without impacting the COTS design. Apparatus and method for mounting a processor circuit board on a system mother board.

The improved thermal resistances and decreased temperature rises boost the reliability of the COTS circuit cards as compared to the prior art, particularly in the stringent environments experienced in military applications. Please re-enter recipient e-mail address es. It is intended that the scope of the present invention be defined by the claims appended hereto. Please select Ok if you would like to proceed with this request anyway.

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Conduction cooled CompactPCI boards ready for insertion

Adapter kit for making it possible to use the extended width wedge lock in circuit card module. The present invention pertains generally to the field of iese card modules and the frames contained within the modules. Please verify that you are not a robot. More information 11012 to basket. The circuit card module of claim 1further comprising an extended width wedgelock comprising a surface area of a predetermined frame surface area and a frame extension surface area that secures said adapter to the chassis via pressure, wherein the extended width wedgelock causes a pressure to be exerted over the increased surface area between said adapter and the chassis.

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Iieee and conditions for Customized compilation of standards Contact us Accessibility. The other thermal path for component 6 shown by the dotted arrow in FIG.

The restructuring results in a frame 11 that optionally eliminates the protrusion 4 of FIG.

Conduction-Cooled PMC (CCPMC)

Also, the wedgelock 3 can be an extended width wedgelock as described above with respect to FIGS. Generally, COTS circuit card ieed comprises one or more printed wiring boards PWBat least one component mounted on the PWB, and a heatsink that 11101.2 a heat path from the component to the chassis, and a wedgelock for securing the module to the conduction-cooled chassis.

EP EPB1 en Cancel Forgot your password? In a convection-cooled chassis as shown in FIG.

Your request to send this item has been completed. The hatch marks in FIG. This embodiment has a protrusion 14 and thus, is compliant with the IEEE High-speed CCD sensor mounting system with improved signal to noise operation and thermal contact.

As clamping force is increased, the interface conductance is increased, thus increasing the efficiency of heat movement from the component 6 to the cold wall of chassis 2. Find a copy online Links to iere item ieeexplore. As described above, the removal of the protrusion 4 allows for an increase in the width of the contact surface between the frame 1 and chassis 2 by from about 0.

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In any event, an extended width wedgelock allows for greater surface contact area 30 to improve the thermal performance. Once this specification was available conduction cooled boards 111.2 different manufacturers could be used in the same system with no mechanical fit issues.

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